Product Type: Solder / Paste

Durafuse™ LT Low-Temperature Alloy System: The Tough Choice That is Easy to Make

Award-winning Durafuse™ LT is a patented low-temperature alloy system by Indium Corporation designed to provide high reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and can perform better than SAC305 with optimal process setup. Durafuse™ LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse™ LT is ideal for high-reliability applications that utilize thermally sensitive components or boards and/or have a requirement for step soldering. End-use applications for Durafuse™ LT include handheld mobile devices, computing, automotive, and medical devices.

Durafuse™ LT Delivers:

• Improved drop shock performance more than two orders of magnitude better than bismuth-containing low-temperature materials
• Drop shock performance equal to or better than SAC305 with proper process optimization
• Ideal characteristics for step soldering and low-temperature requirements
• A wide processing window compatible with large temperature gradients

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Indium Corporation’s bar solder is manufactured specifically to surpass the strict quality demands of the surface mount industry in order to provide a more consistent and reliable performance. Bar solder is available in the standard Sn62 (Pb-containing) and Pb-free alloys, such as SAC305 and Indalloy 291 (99.25Sn/0.7Cu/0.05Ni/Ge). All bar solder complies with the requirements of ASTEM B-32, J-STD-006, and JIs-Z-3282.

CW-301 is a water-soluble flux-cored wire optimized for use with SnPb and Pb-free assembly and rework processes. It has minimal spattering and low odor and is resistant to charring. It wets to common Pb-free surface finishes including Immersion Sn, ENIG, OSP, and Immersion Ag.

CW-807 is a halogen-free, no-clean flux-cored wire and is our most popular wire because it is compatible with all Indium Corporation’s no-clean solder pastes, wave fluxes, and soft solder alloys. It solders well while still meeting the most recent requirements of J-STD-004B type ROL0. It also passes the more stringent Surface Insulation Resistance (SIR) and Electromigration (ECM) requirements of J-STD-004 revision B.

Indium Corporation is quickly becoming known as one of the highest-quality full-line supplies of flux-cored wire solder. Its flux-cored wire contains flux in the center to facilitate the soldering process and eliminate the need for a separate flux and can be used for robotic soldering, manual soldering, or rework. Indium Corporation uses only “conflict-free” and grade A (per ASTM B32) metals and the materials have been tested and certified to meet IPC J-STD-004B standards. Indium Corporation’s flux-cored wire is well known for its void-free, evenly layered winding and has a low-oxide shiny appearance over time.

CORE 230-RC is one of the newest and most popular flux-cored wire products and features:

• A very fast wetting speed
• Void-free & precision wound
• A low-spatter formulation
• Light-colored residue
• Compatibility with Pb-free and SnPb alloys

Physical Properties

• IPC J-STD-004 classification: REL0
• IPC J-STD-004B classification: REL1
• Spatter: <1%
• Acid value (mgKOH/gram of flux): 165

Indium10.1 is a supercharged air reflow capable, no-clean, Pb-free solder paste.  Similar to Indium8.9HF, it is popular with electronics manufacturers who are able to use halogen-containing materials.  Indium10.1 has a high oxidation resistance to virtually eliminate incomplete coalescence (graping) of small deposits and warpage-induced head-in-pillow defects.  It also offers extremely low, large ground-plane voiding found in QFN, LGA, and DPAK components.

Indium8.9HF is a high-performance Pb-free solder paste and is being used heavily by electronic manufacturers in the automotive, industrial, and medical markets.  It is an air-reflow-capable, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SAC and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.  It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.  This coupled with its low voiding and enhanced SIR/ECM performance attributes make this and ideal solder paste for the vast majority of all electronic manufacturing applications.

NC-SMQ92J is widely known as the best halogen-free SnPb solder paste on the market.  It is a halogen-free, air-reflow-capable, no-clean solder paste formulated for superior manufacturing yields and ICT performance.  It provides consistent fine-pitch paste deposition with an excellent stencil life and tack time.  It has a soft flux residue for outstanding ICT first-pass yield.  NC-SMQ92J will surpass all J-STD-004, and J-STD-005 specifications.