Durafuse™ LT Low-Temperature Alloy System: The Tough Choice That is Easy to Make
Award-winning Durafuse™ LT is a patented low-temperature alloy system by Indium Corporation designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and can perform better than SAC305 with optimal process setup. Durafuse™ LT is made up of a low-melting indium-containing alloy and a higher melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse™ LT is ideal for high-reliability applications that utilize thermally sensitive components or boards and/or have a requirement for step soldering. End-use applications for Durafuse™ LT include handheld mobile devices, computing, automotive, and medical devices.
Durafuse™ LT Delivers:
- Improved drop shock performance more than two orders of magnitude better than bismuth-containing low-temperature materials
- Drop shock performance equal to or better than SAC305 with proper process optimization
- Ideal characteristics for step soldering and low-temperature requirements
- A wide processing window compatible with large temperature gradients
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