Durafuse™ LT

Durafuse™ LT Low-Temperature Alloy System: The Tough Choice That is Easy to Make

Award-winning Durafuse™ LT is a patented low-temperature alloy system by Indium Corporation designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and can perform better than SAC305 with optimal process setup. Durafuse™ LT is made up of a low-melting indium-containing alloy and a higher melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse™ LT is ideal for high-reliability applications that utilize thermally sensitive components or boards and/or have a requirement for step soldering. End-use applications for Durafuse™ LT include handheld mobile devices, computing, automotive, and medical devices.

Durafuse™ LT Delivers:

  • Improved drop shock performance more than two orders of magnitude better than bismuth-containing low-temperature materials
  • Drop shock performance equal to or better than SAC305 with proper process optimization
  • Ideal characteristics for step soldering and low-temperature requirements
  • A wide processing window compatible with large temperature gradients

Click here for a product sheet.

Click here for a datasheet.

inquire about product Click for Manufacturer site: http://www.indium.com/

Contact us

Durafuse™ LT

Durafuse™ LT Low-Temperature Alloy System: The Tough Choice That is Easy to Make

Award-winning Durafuse™ LT is a patented low-temperature alloy system by Indium Corporation designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and can perform better than SAC305 with optimal process setup. Durafuse™ LT is made up of a low-melting indium-containing alloy and a higher melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse™ LT is ideal for high-reliability applications that utilize thermally sensitive components or boards and/or have a requirement for step soldering. End-use applications for Durafuse™ LT include handheld mobile devices, computing, automotive, and medical devices.

Durafuse™ LT Delivers:

  • Improved drop shock performance more than two orders of magnitude better than bismuth-containing low-temperature materials
  • Drop shock performance equal to or better than SAC305 with proper process optimization
  • Ideal characteristics for step soldering and low-temperature requirements
  • A wide processing window compatible with large temperature gradients

Click here for a product sheet.

Click here for a datasheet.

manufacturer website Click for Manufacturer site: http://www.indium.com/

Contact us

Continue

Durafuse™ LT

Durafuse™ LT Low-Temperature Alloy System: The Tough Choice That is Easy to Make

Award-winning Durafuse™ LT is a patented low-temperature alloy system by Indium Corporation designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and can perform better than SAC305 with optimal process setup. Durafuse™ LT is made up of a low-melting indium-containing alloy and a higher melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse™ LT is ideal for high-reliability applications that utilize thermally sensitive components or boards and/or have a requirement for step soldering. End-use applications for Durafuse™ LT include handheld mobile devices, computing, automotive, and medical devices.

Durafuse™ LT Delivers:

  • Improved drop shock performance more than two orders of magnitude better than bismuth-containing low-temperature materials
  • Drop shock performance equal to or better than SAC305 with proper process optimization
  • Ideal characteristics for step soldering and low-temperature requirements
  • A wide processing window compatible with large temperature gradients

Click here for a product sheet.

Click here for a datasheet.

manufacturer website http://www.indium.com/

Contact us

Continue

contact us call us today! 800-590-4055