Indium8.9HF Pb-Free Solder Paste

Indium8.9HF is a high-performance Pb-free solder paste and is being used heavily by electronic manufacturers in the automotive, industrial, and medical markets.  It is an air reflow capable, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SAC and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.  It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.  This coupled with its low voiding and enhanced SIR/ECM performance attributes make this and ideal solder paste for the vast majority of all electronic manufacturing applications.

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Indium8.9HF Pb-Free Solder Paste

Indium8.9HF is a high-performance Pb-free solder paste and is being used heavily by electronic manufacturers in the automotive, industrial, and medical markets.  It is an air reflow capable, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SAC and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.  It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.  This coupled with its low voiding and enhanced SIR/ECM performance attributes make this and ideal solder paste for the vast majority of all electronic manufacturing applications.

manufacturer website Click for Manufacturer site: http://www.indium.com/

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Indium8.9HF Pb-Free Solder Paste

Indium8.9HF is a high-performance Pb-free solder paste and is being used heavily by electronic manufacturers in the automotive, industrial, and medical markets.  It is an air reflow capable, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SAC and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.  It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.  This coupled with its low voiding and enhanced SIR/ECM performance attributes make this and ideal solder paste for the vast majority of all electronic manufacturing applications.

manufacturer website http://www.indium.com/

Contact us

Continue

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