AcceleRate® HP Extreme Density Cable System
The AcceleRate® HP cable system provides an excellent mix of density and performance. The 0.635 mm pitch board connector uses Samtec’s popular AcceleRate® contacts with staggered row-to-row spacing, allowing adequate routing lanes for differential pair, single-ended, or mixed signal (-DP & -SE) paths.
The cable assembly features Samtec’s optimized direct attach technology for impedance control and lower losses through Eye Speed Thinax™ ultra-low skew twinax cable or Eye Speed ThinSE™ thin micro coax cable. The addition of a retention shroud provides a robust cabled interconnect.
Features
- Industry’s highest density 112 Gbps PAM4 near-chip cable-to-board system or co-packaged (direct-to-chip package) solution
- Near-chip solution overcomes the challenges of launching a high number of transmission lines off the board close to the chip (ARP6, APF6-L/APF6-T/APF6-S/APF6-RA-S)
- Co-packaged (direct-to-chip package) solution offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (ART6, ATF6)
- Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
- 32 to 96 differential pairs
- 4, 6, or 8 rows
- 34 AWG Eye Speed Thinax™ ultra-low skew twinax cable, or 34 AWG Eye Speed ThinSE™ thin micro coax cable
- Eye Speed Thinax™ cable technology provides overall weight reduction and maximizes airflow, making it easy to route through systems; ultra-low skew 3.5 ps/meter max
- Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
- Ideal for AI, high-performance computing (HPC), and data center applications
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