ALN Series
Ohmite has the solution for high-wattage surface mount chips. The ALN series thick film chips offer 3.5 watts of power dissipation in a 2512 package size. This is accomplished with the use of an Aluminum Nitride substrate. Aluminum Nitride (AlNi) dissipates heat far more efficiently than standard Alumina or Ceramic substrates. Ohmite has engineered a thick film printing process to apply a resistive ink to the AlNi substrate creating an optimal chip for high power. Temperature coefficients are down to 150 ppm providing a chip with great stability.
Features
- Thick film resistive element on an aluminum nitride (AlN) substrate
- Lead (Pb)-free wraparound termination over nickel barrier
- Industry-standard size 2512 for easy PCB application
Applications
- Industrial
- Telecom markets
