SEAF Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Socket
This open-pin-field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder-charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Features
- Up to 500 I/Os
- .050″ (1.27 mm) pitch
- Rugged Edge Rate® contact
- 56 Gbps PAM4 performance
- Stack heights from 7 mm – 18.5 mm
- Lower insertion/withdrawal forces
- Solder-charge termination
- Dual sourced by Molex®
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
