SEAF Series – .050″ SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

Features

  • Up to 500 I/Os
  • .050″ (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm – 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
inquire about product Click for Manufacturer site: https://www.samtec.com/

Contact us

SEAF Series – .050″ SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

Features

  • Up to 500 I/Os
  • .050″ (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm – 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
manufacturer website Click for Manufacturer site: https://www.samtec.com/

Contact us

Continue

SEAF Series – .050″ SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

Features

  • Up to 500 I/Os
  • .050″ (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm – 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
manufacturer website https://www.samtec.com/

Contact us

Continue

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