HomeProductsSEAM Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Terminal
SEAM Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Terminal
Features
Up to 500 I/Os
.050″ (1.27 mm) pitch
Rugged Edge Rate® contact
56 Gbps PAM4 performance
Lower insertion/withdrawal forces
Solder-charge termination
Stack heights from 7 mm – 18.5 mm
Dual sourced by Molex®
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAM Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Terminal
Features
Up to 500 I/Os
.050″ (1.27 mm) pitch
Rugged Edge Rate® contact
56 Gbps PAM4 performance
Lower insertion/withdrawal forces
Solder-charge termination
Stack heights from 7 mm – 18.5 mm
Dual sourced by Molex®
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAM Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Terminal
Features
Up to 500 I/Os
.050″ (1.27 mm) pitch
Rugged Edge Rate® contact
56 Gbps PAM4 performance
Lower insertion/withdrawal forces
Solder-charge termination
Stack heights from 7 mm – 18.5 mm
Dual sourced by Molex®
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
