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Ultracompact, One-Port Ethernet Serial Server (RS-232/422/485)

BB-VESP211 series Ethernet Serial Servers connect serial devices (RS-232, RS-422, or RS-485) to Ethernet networks, allowing the serial device to become a node on the network. The serial port can be accessed over a LAN/WAN using Direct IP Mode, Virtual COM Port, or Paired Mode connections. BB-VESP211 series Ethernet Serial Servers feature 10BaseT or 100BaseTX copper network.

Flexible, Adaptable LTE Router

SmartFlexTM cellular router provides secure Internet connectivity for devices and LANs via cellular networks. It can provide automatic wireless failover for wired networks, wireless connectivity for devices in remote locations where cable connections are impractical, and wireless connectivity for mobile assets. With upload speeds of up to 50 Mbps and download speeds of up to 100 Mbps, SmartFlex provides ample bandwidth, even for applications that require video.

Bar Solder – Pb-Free and SnPb

Indium Corporation’s bar solder is manufactured specifically to surpass the strict quality demands of the surface mount industry in order to provide a more consistent and reliable performance. Bar solder is available in the standard Sn62 (Pb-containing) and Pb-free alloys, such as SAC305 and Indalloy 291 (99.25Sn/0.7Cu/0.05Ni/Ge). All bar solder complies with the requirements of ASTEM B-32, J-STD-006, and JIs-Z-3282.

CW-301 Flux-Cored Wire

CW-301 is a water-soluble flux-cored wire optimized for use with SnPb and Pb-free assembly and rework processes. It has minimal spattering and low odor and is resistant to charring. It wets to common Pb-free surface finishes including Immersion Sn, ENIG, OSP, and Immersion Ag.

CW-807 Flux-Cored Wire

CW-807 is a halogen-free, no-clean flux-cored wire and is our most popular wire because it is compatible with all Indium Corporation’s no-clean solder pastes, wave fluxes, and soft solder alloys. It solders well while still meeting the most recent requirements of J-STD-004B type ROL0. It also passes the more stringent Surface Insulation Resistance (SIR) and Electromigration (ECM) requirements of J-STD-004 revision B.

CORE 230-RC: High-Performance, No-Clean Flux-Cored Wire

Indium Corporation is quickly becoming known as one of the highest-quality full-line supplies of flux-cored wire solder. Its flux-cored wire contains flux in the center to facilitate the soldering process and eliminate the need for a separate flux and can be used for robotic soldering, manual soldering, or rework. Indium Corporation uses only “conflict-free” and grade A (per ASTM B32) metals and the materials have been tested and certified to meet IPC J-STD-004B standards. Indium Corporation’s flux-cored wire is well known for its void-free, evenly layered winding and has a low-oxide shiny appearance over time.

CORE 230-RC is one of the newest and most popular flux-cored wire products and features:

  • A very fast wetting speed
  • Void-free & precision wound
  • A low-spatter formulation
  • Light-colored residue
  • Compatibility with Pb-free and SnPb alloys

Physical Properties

  • IPC J-STD-004 classification: REL0
  • IPC J-STD-004B classification: REL1
  • Spatter: <1%
  • Acid value (mgKOH/gram of flux): 165

Indium10.1 Pb-Free Solder Paste

Indium10.1 is a supercharged air reflow capable, no-clean, Pb-free solder paste.  Similar to Indium8.9HF, it is popular with electronics manufacturers who are able to use halogen-containing materials.  Indium10.1 has a high oxidation resistance to virtually eliminate incomplete coalescence (graping) of small deposits and warpage-induced head-in-pillow defects.  It also offers extremely low, large ground-plane voiding found in QFN, LGA, and DPAK components.

Indium8.9HF Pb-Free Solder Paste

Indium8.9HF is a high-performance Pb-free solder paste and is being used heavily by electronic manufacturers in the automotive, industrial, and medical markets.  It is an air-reflow-capable, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SAC and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.  It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.  This coupled with its low voiding and enhanced SIR/ECM performance attributes make this and ideal solder paste for the vast majority of all electronic manufacturing applications.

NC-SMQ92J SnPb Solder Paste

NC-SMQ92J is widely known as the best halogen-free SnPb solder paste on the market.  It is a halogen-free, air-reflow-capable, no-clean solder paste formulated for superior manufacturing yields and ICT performance.  It provides consistent fine-pitch paste deposition with an excellent stencil life and tack time.  It has a soft flux residue for outstanding ICT first-pass yield.  NC-SMQ92J will surpass all J-STD-004, and J-STD-005 specifications.

Carbonated Water Dispensing Valve

Two-way solenoid valve designed to dispense still or carbonated water 0 to 6 psi and withstand a carbonation pressure of up to 150 psi prior to venting and dispensing. Design features to reduce decarbonization include uniform internal transitions and the same diameter inlet and orifice I.D.