Product Type: Interconnect

FTSH Series – .050″ Micro Terminal Strip

This microheader features a variety of standard options and is an Extended Life Product™, passing ten-year Mixed Flowing Gas (MFG) and achieving high mating cycles (250 to 2,500). Options include a variety of post heights, a choice of surface mount, through-hole or mixed technology tails, vertical or horizontal orientations, polarization, and keying, as well as end shrouds and ejector shrouds for alignment or blind mating.

Features

  • Microheader with various post heights
  • Available in surface mount and through-hole tails
  • End shroud option available
  • Cost-saving flash gold plating available
  • Vertical and horizontal row configurations
  • Extended Life Product™ (E.L.P.™)
  • Hot Pluggable version available

LSHM Series – 0.50 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

  • Ten stack height options from 5.00 mm to 12.00 mm
  • Mating and unmating forces approximately 4-6 times greater than typical micro pitch connectors
  • Audible click when mated
  • Parallel, perpendicular, and coplanar systems
  • Up to 100 I/Os
  • Shield option available
  • Self-mating system reduces inventory cost
  • Lubricated option available

For applications requiring two or more connectors per board, please click here for a Multiple LSXX Connector Applications flyer.

SEAF Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Socket

This open-pin-field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder-charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

Features

  • Up to 500 I/Os
  • .050″ (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm – 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder-charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

SEAM Series – .050″ SEARAY™ High-Speed, High-Density Open-Pin-Field Array Terminal

Features

  • Up to 500 I/Os
  • .050″ (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder-charge termination
  • Stack heights from 7 mm – 18.5 mm
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

TFM Series – .050″ Tiger Eye™ High-Reliability Terminal Strip

This rugged Tiger Eye™ terminal strip features a multi-finger, BeCu contact system designed for high-reliability and high-cycle applications with surface mount or through-hole tails. Vertical or right-angle orientations for parallel, perpendicular and coplanar mating increase design flexibility, along with optional alignment pin, locking clip, dual screw down, or weld tab for more rugged applications.

Features

  • Shrouded body for blind mating
  • Pitch: .050″ (1.27 mm)
  • Contact System: .018″ (0.46 mm) diameter post
  • Orientation: Vertical, right-angle, horizontal
  • Termination: Through-hole, surface mount
  • Application: Mating with high-reliability Tiger Eye™ contact sockets and cable assemblies
  • Multiple stack heights
  • Special Features: Screw down, weld tab, and solder nail options available for most rugged requirements
  • Extended Life Product™ (E.L.P.™)

SFM Series – .050″ Tiger Eye™ High-Reliability Socket Strip

Features

  • Pitch: .050″ (1.27 mm)
  • Contact System: Tiger Eye™
  • Orientation: Vertical, horizontal
  • Termination: Through-hole, surface mount
  • Application: Polarized single- and double-row multi-finger BeCu contact system to 100 pins
  • Special Features: Screw-down and solder nail options available for most rugged requirements
  • Extended Life Product™ (E.L.P.™)

JWPS Series – Wire-to-Board (IP67)

This JWPS connector can be used in a place where waterproofing is required. This is the wire-to-board connector that is grade-7 ingress protection of JIS C 0920 (IPX7 of IEC 60529).

  • Waterproof performance
  • Contained seal ring
  • Solid rubber seal
  • Double-spring construction
  • Housing-to-terminal locks
  • Mismating prevention key

JWPS Series – Wire-to-Wire (IP67)

This JWPS connector can be used in a place where waterproofing is required. This is the wire-to-wire connector that is grade-7 ingress protection of JIS C 0920 (IPX7 of IEC 60529).

  • Waterproof performance
  • Contained seal ring
  • Solid rubber seal
  • Double-spring construction
  • Housing-to-terminal locks
  • Mismating prevention key

JWPF Series – Wire-to-Board (IP67)

Applicable for waterproof usage. Its waterproof grade is 7 ingress protection of JIS C 0920 (IEC 60529 IPX7).

  • Waterproof performance
  • Contained seal ring
  • Solid rubber seal
  • Double-spring construction
  • Housing-to-terminal locks
  • Inner housing lock
  • Header for use specifically with resin-coated (“potted”) PC board